ADSP-BF539F(RevA) Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

ADSP-BF539F
(Rev.:RevA)

Blackfin Embedded Processor

Analog Devices 

ADSP-BF539/ADSP-BF539F

SURFACE-MOUNT DESIGN

Table 40 is provided as an aid to PCB design. For industry-

standard design recommendations, refer to IPC-7351,

Generic Requirements for Surface Mount Design and Land Pattern Standard.

Table 40. BGA Data for Use with Surface-Mount Design

Package

Ball Attach Type

316-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-316) Solder Mask Defined

Solder Mask Opening

0.40 mm diameter

ORDERING GUIDE

Ball Pad Size

0.50 mm diameter

Model1

ADSP-BF539BBCZ-5A3

ADSP-BF539BBCZ-5F43

ADSP-BF539BBCZ-5F83

Temperature

Range2

–40ЊC to +85ЊC

–40ЊC to +85ЊC

–40ЊC to +85ЊC

Package Description

316-Ball Chip Scale Package

Ball Grid Array [CSP_BGA]

316-Ball Chip Scale Package

Ball Grid Array [CSP_BGA]

316-Ball Chip Scale Package

Ball Grid Array [CSP_BGA]

Package Instruction Operating Voltage

Option Rate (Max) (Nominal)

BC-316 533 MHz 1.25 V internal/ 3.3 V I/O

BC-316 533 MHz 1.25 V internal/ 3.3 V I/O

BC-316 533 MHz 1.25 V internal/ 3.3 V I/O

1 A similar part is available for use in specific automotive applications. Contact your local ADI sales office for the ADBF539W Automotive Data Sheet which highlights any

specification changes and ordering information.

2 Referenced temperature is ambient temperature.

3 Z = RoHS compliant part.

©2008 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D06699-0-2/08(A)

Rev. A | Page 60 of 60 | February 2008

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