ADSP-BF539F(RevA) Просмотр технического описания (PDF) - Analog Devices

Номер в каталоге

Компоненты Описание

производитель

ADSP-BF539F
(Rev.:RevA)

Blackfin Embedded Processor

Analog Devices 

OUTLINE DIMENSIONS

Dimensions in the outline dimensions figures are shown in

millimeters.

ADSP-BF539/ADSP-BF539F

17.00 BSC SQ

A1 BALL INDICATOR

TOP VIEW

15.20 BSC SQ

0.80 BSC BALL PITCH

A1 BALL

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

W

Y

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

BOTTOM VIEW

0.30 MIN

1.70

MAX

SIDE VIEW

DETAIL A

0.12 MAX

COPLANARITY

0.50

BALL DIAMETER 0.45

0.40

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

2. COMPLIANT TO JEDEC REGISTERED OUTLINE MO-205, VARIATION AM,

WITH THE EXCEPTION OF BALL DIAMETER.

3. CENTER DIMENSIONS ARE NOMINAL.

DETAIL A

Figure 55. 316-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-316)

SEATING PLANE

Rev. A | Page 59 of 60 | February 2008

Share Link: