ADSP-BF539F(RevA) Просмотр технического описания (PDF) - Analog Devices
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ADSP-BF539F Datasheet PDF : 60 Pages
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THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use
TJ = TCASE + (ΨJT × PD)
where
TJ = Junction temperature (؇C)
TCASE = Case temperature (؇C) measured by customer at top
center of package.
ΨJT = From Table 36 or Table 37
PD = Power dissipation (see Power Dissipation on Page 52 for
the method to calculate PD)
Values of θJA are provided for package comparison and printed
circuit board design considerations. θJA can be used for a first
order approximation of TJ by the equation:
TJ = TA + (θJA × PD)
where:
TA = Ambient temperature (؇C)
Values of θJC are provided for package comparison and printed
circuit board design considerations when an external heatsink is
required.
Values of θJB are provided for package comparison and printed
circuit board design considerations.
In Table 36 and Table 37, airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6, and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883 (Method
1012.1). All measurements use a 2S2P JEDEC test board.
Table 36. Thermal Characteristics BC-316 Without Flash
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJT
ΨJT
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Typical
21.6
18.8
18.1
5.36
0.13
0.25
0.25
Unit
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
Table 37. Thermal Characteristics BC-316 With Flash
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJT
ΨJT
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Typical
20.9
18.1
17.4
5.01
0.12
0.24
0.24
Unit
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
؇C/W
ADSP-BF539/ADSP-BF539F
Rev. A | Page 55 of 60 | February 2008
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