82545GM Просмотр технического описания (PDF) - Intel

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Компоненты Описание

производитель

82545GM

Gigabit Ethernet Controller

Intel 

2.7

Networking Silicon — 82545GM

Technology

Features

364-pin Ball Grid Array (BGA) package

Footprint compatible with the 82544GC, 82545EM,

and 82546EB controllers

Implemented in 0.15µ CMOS process

0 C to 70 C (maximum) operating temperature

Heat sink or forced airflow not required

65 C to 140 C storage temperature range

3.3 V (5 V tolerant) PCI signaling with power

dissipation less than 2.0 W (maximum)

Improved SERDES differential output

Benefits

• 21 mm x 21 mm component making LOM designs

easier

• Single port or dual port implementation on the

same board with minor option changes

• Offers lowest geometry to minimize power and

size while maintaining Intel quality reliability

standards

• Simple thermal design

• Lower power requirements

• Complies with PICMG 3.1 Specification

Datasheet

7

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