MT90881 Просмотр технического описания (PDF) - Zarlink Semiconductor Inc

Номер в каталоге

Компоненты Описание

производитель

MT90881

TDM to Packet Processors

Zarlink Semiconductor Inc 

MT90880/1/2/3

Data Sheet

2.0 Physical Specification

The device is contained in a 456-ball plastic ball grid array (456 PBGA) package:

• Body Size: 27 mm x 27 mm

• Ball Count: 456

• Ball Pitch: 1.0 mm

• Ball Matrix: 26 x 26 (partially populated with a 6 x 6 GND matrix in the centre)

• Ball Diameter 0.63 mm

• Total Package Thickness 2.03 mm

Package is viewed from the top side (e.g,. through top of the package). Note ball A1 is non-chamfered corner.

Figure 2 - Package View and Ball Positions

11

Zarlink Semiconductor Inc.

Share Link: