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HMC283 Просмотр технического описания (PDF) - Hittite Microwave

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HMC283 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
v03.1007
Absolute Maximum Ratings
Drain Bias Voltage
(Vdd1, Vdd2, Vdd3, Vdd4)
Drain Bias Current (Idd)
Gate Bias Voltage
(Vgg1, Vgg2, Vgg3, Vgg4)
Gate Bias Current (Igg)
RF Input Power (RFIN)(Vdd = +3.5 Vdc)
Channel Temperature
Continuous Pdiss (T = 85 °C)
(derate 13.04 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
+5Vdc
400 mA
-2 to +0.4Vdc
4 mA
+8 dBm
175 °C
1.174 W
76.7 °C/W
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC283
GaAs MMIC MEDIUM POWER
AMPLIFIER, 17 - 40 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
3
Die Packaging Information [1]
Standard
Alternate
GP-2
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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