DSP56F826PB Просмотр технического описания (PDF) - Motorola => Freescale

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DSP56F826PB

16-bit Hybrid Controller

Motorola => Freescale 

Freescale Semiconductor, Inc.

Table 5. Recommended Operating Conditions

Characteristic

Symbol

Min

Typ

Max

Unit

Supply voltage, core

Supply Voltage, IO and analog

Ambient operating temperature

VDD

2.4

2.5

2.75

V

VDDIO,VDDA

3.0

3.3

3.6

V

TA

–40

–

85

°C

Table 6. Thermal Characteristics6

Characteristic

Comments

Symbol

Junction to ambient

Natural convection

Junction to ambient (@1m/sec)

Junction to ambient

Natural convection

Four layer board (2s2p)

Junction to ambient (@1m/sec) Four layer board (2s2p)

Junction to case

Junction to center of case

I/O pin power dissipation

Power dissipation

Junction to center of case

RθJA

RθJMA

RθJMA

(2s2p)

RθJMA

RθJC

ΨJT

P I/O

PD

PDMAX

Value

100-pin LQFP

48.3

43.9

40.7

38.6

13.5

1.0

User Determined

P D = (IDD x VDD + P I/O)

(TJ - TA) /θJA

Unit Notes

°C/W

2

°C/W

2

°C/W 1.2

°C/W 1,2

°C/W

3

°C/W 4, 5

W

W

°C

Notes:

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.

Determined on 2s2p thermal test board.

2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the

JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was

also simulated on a thermal test board with two internal planes (2s2p, where “s” is the number of

signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name for

Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the

measured values using the cold plate technique with the cold plate temperature used as the “case”

temperature. The basic cold plate measurement technique is described by MIL-STD 883D, Method

1012.1. This is the correct thermal metric to use to calculate thermal performance when the package

is being used with a heat sink.

4. Thermal Characterization Parameter, Psi-JT (ΨJT ), is the “resistance” from junction to reference

point thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to

estimate junction temperature in steady state customer environments.

16

56F826 Technical Data

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