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TDA7495SA Просмотр технического описания (PDF) - STMicroelectronics

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TDA7495SA Datasheet PDF : 15 Pages
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TDA7495SA
4
Thermal considerations
Thermal considerations
In order to avoid the intervention of the thermal protection, it is important to choose an
adequate heatsink.
The parameters that influence the heatsink size are:
" maximum dissipated power for the device (Pdmax)
" maximum thermal resistance junction to case (RTh j-c)
" maximum ambient temperature Tamb_max
Example:
For VCC = 20 V, RL = 8 , RTh j-c = 5° C/W, Tamb_max = 50° C
Pdmax = Number_of_channels *
-----V-----c---c---2-------
2Π2 RL
=5W
For the heatsink,
RTh j-c
=
1----5---0-----–-----T---a---m----b---_---m---a---x-
Pd max
RTh
j-c
=
1----0---0-- – 5
5
=
15°C/W
Figure 25 shows the power derating curve for the device.
Figure 25. Power derating curve
20
15
(d)
(a)
10
(b)
5
(c)
a) Infinite Heatsink
b) 7 °C/ W
c) 10 °C/ W
d) 3.3 °C/ W
0
0
40
80
120
160
Tamb (°C)
11/15

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