DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

TDA7495SA Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
TDA7495SA Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
Clipwatt mounting suggestions
5
Clipwatt mounting suggestions
TDA7495SA
The suggested method for securing the Clipwatt package on an external heat sink is by a
spring clip placed as close as possible to the center of the plastic body, as indicated in the
example of Figure 26.
Thermal grease can be used to further reduce the thermal resistance of the contact
between package and heatsink.
The clip should apply a force of 7 - 10 kg to provide sufficient pressure for a good contact.
Care must be taken to ensure that the contact pressure on the package does not exceed
15 kg/mm².
As an example, if the clip applies a 15-kg force on the package then the clip must have a
contact area of at least 1 mm².
Figure 26. Example of correctly placed clip
12/15

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]