BD82HM55QMNT Просмотр технического описания (PDF) - Intel
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BD82HM55QMNT Datasheet PDF : 934 Pages
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22.2.22HTS—Host Status (Mobile Only) ............................................................. 860
22.2.23PTL— Processor Temperature Limit (Mobile Only) ..................................... 860
22.2.24MGTV— Memory Controller/Graphics Temperature Value ........................... 860
22.2.25PTV—Processor Temperature Value......................................................... 861
22.2.26MMGPC—Max Memory Controller/Graphics Power Clamp (Mobile Only) ........ 861
22.2.27MPPC—Max Processor Power Clamp (Mobile Only)..................................... 861
22.2.28MPCPC—Max Processor Core Power Clamp (Mobile Only) ........................... 861
22.2.29TSPIEN—Thermal Sensor PCI Interrupt Enable ......................................... 862
22.2.30TSLOCK—Thermal Sensor Register Lock Control ....................................... 863
22.2.31STS—Turbo Status (Mobile Only)............................................................ 863
22.2.32SEC—Event Clear (Mobile Only).............................................................. 863
22.2.33TC3—Thermal Compares 3 .................................................................... 864
22.2.34TC1—Thermal Compares 1 .................................................................... 864
22.2.35TC2—Thermal Compares 2 .................................................................... 865
22.2.36DTV—DIMM Temperature Values ............................................................ 865
22.2.37ITV—Internal Temperature Values .......................................................... 866
23 Intel® Management Engine Interface (MEI) Subsystem Registers (D22:F0).......... 867
23.1 First Intel Management Engine Interface (Intel® MEI) Configuration Registers
(MEI—D22:F0)................................................................................................ 867
23.1.1 VID—Vendor Identification Register
(MEI—D22:F0)..................................................................................... 868
23.1.2 DID—Device Identification Register
(MEI—D22:F0)..................................................................................... 868
23.1.3 PCICMD—PCI Command Register
(MEI—D22:F0)..................................................................................... 869
23.1.4 PCISTS—PCI Status Register
(MEI—D22:F0)..................................................................................... 869
23.1.5 RID—Revision Identification Register
(MEI—D22:F0)..................................................................................... 870
23.1.6 CC—Class Code Register
(MEI—D22:F0)..................................................................................... 870
23.1.7 HTYPE—Header Type Register
(MEI—D22:F0)..................................................................................... 870
23.1.8 MEI0_MBAR—MEI0 MMIO Base Address Register
(MEI—D22:F0)..................................................................................... 871
23.1.9 SVID—Subsystem Vendor ID Register
(MEI—D22:F0)..................................................................................... 871
23.1.10SID—Subsystem ID Register
(MEI—D22:F0)..................................................................................... 871
23.1.11CAPP—Capabilities List Pointer Register
(MEI—D22:F0)..................................................................................... 871
23.1.12INTR—Interrupt Information Register
(MEI—D22:F0)..................................................................................... 872
23.1.13HFS—Host Firmware Status Register
(MEI—D22:F0)..................................................................................... 872
23.1.14ME_UMA—Management Engine UMA Register
(MEI—D22:F0)..................................................................................... 872
23.1.15GMES—General ME Status
(MEI—D22:F0)..................................................................................... 873
23.1.16H_GS—Host General Status
(MEI—D22:F0)..................................................................................... 873
23.1.17PID—PCI Power Management Capability ID Register
(MEI—D22:F0)..................................................................................... 873
23.1.18PC—PCI Power Management Capabilities Register
(MEI—D22:F0)..................................................................................... 874
23.1.19PMCS—PCI Power Management Control and Status
Register (MEI—D22:F0) ........................................................................ 874
23.1.20MID—Message Signaled Interrupt Identifiers Register
(MEI—D22:F0)..................................................................................... 875
23.1.21MC—Message Signaled Interrupt Message Control Register
(MEI—D22:F0)..................................................................................... 875
23.1.22MA—Message Signaled Interrupt Message Address Register
(MEI—D22:F0)..................................................................................... 875
23.1.23MUA—Message Signaled Interrupt Upper Address Register
(MEI—D22:F0)..................................................................................... 875
Datasheet
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