BD82HM55QMNT Просмотр технического описания (PDF) - Intel
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BD82HM55QMNT Datasheet PDF : 934 Pages
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21.4.9 FREG2—Flash Region 2 (Intel® ME) Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 834
21.4.10FREG3—Flash Region 3 (GbE) Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 835
21.4.11PR0—Protected Range 0 Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 835
21.4.12PR1—Protected Range 1 Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 836
21.4.13SSFS—Software Sequencing Flash Status Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 837
21.4.14SSFC—Software Sequencing Flash Control Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 838
21.4.15PREOP—Prefix Opcode Configuration Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 839
21.4.16OPTYPE—Opcode Type Configuration Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 839
21.4.17OPMENU—Opcode Menu Configuration Register
(GbE LAN Memory Mapped Configuration Registers) .................................. 840
22 Thermal Sensor Registers (D31:F6) ....................................................................... 841
22.1 PCI Bus Configuration Registers......................................................................... 841
22.1.1 VID—Vendor Identification ..................................................................... 842
22.1.2 DID—Device Identification ..................................................................... 842
22.1.3 CMD—Command................................................................................... 842
22.1.4 STS—Status......................................................................................... 843
22.1.5 RID—Revision Identification ................................................................... 843
22.1.6 PI— Programming Interface ................................................................... 843
22.1.7 SCC—Sub Class Code ............................................................................ 844
22.1.8 BCC—Base Class Code........................................................................... 844
22.1.9 CLS—Cache Line Size ............................................................................ 844
22.1.10LT—Latency Timer ................................................................................ 844
22.1.11HTYPE—Header Type............................................................................. 844
22.1.12TBAR—Thermal Base............................................................................. 845
22.1.13TBARH—Thermal Base High DWord ......................................................... 845
22.1.14SVID—Subsystem Vendor ID.................................................................. 845
22.1.15SID—Subsystem ID .............................................................................. 846
22.1.16CAP_PTR —Capabilities Pointer ............................................................... 846
22.1.17Offset 3Ch – INTLN—Interrupt Line ......................................................... 846
22.1.18INTPN—Interrupt Pin ............................................................................. 846
22.1.19TBARB—BIOS Assigned Thermal Base Address.......................................... 847
22.1.20TBARBH—BIOS Assigned Thermal Base High DWord .................................. 847
22.1.21PID—PCI Power Management Capability ID .............................................. 847
22.1.22PC—Power Management Capabilities ....................................................... 848
22.1.23PCS—Power Management Control And Status ........................................... 848
22.2 Thermal Memory Mapped Configuration Registers
(Thermal Sensor – D31:F26) ............................................................................. 849
22.2.1 TSIU—Thermal Sensor In Use................................................................. 850
22.2.2 TSE—Thermal Sensor Enable.................................................................. 850
22.2.3 TSS—Thermal Sensor Status .................................................................. 851
22.2.4 TSTR—Thermal Sensor Thermometer Read .............................................. 851
22.2.5 TSTTP—Thermal Sensor Temperature Trip Point........................................ 852
22.2.6 TSCO—Thermal Sensor Catastrophic Lock-Down ....................................... 852
22.2.7 TSES—Thermal Sensor Error Status ........................................................ 853
22.2.8 TSGPEN—Thermal Sensor General Purpose Event Enable ........................... 854
22.2.9 TSPC—Thermal Sensor Policy Control ...................................................... 855
22.2.10PPEC—Processor Power Error Correction (Mobile Only)............................... 855
22.2.11CTA—Processor Core Temperature Adjust ................................................ 856
22.2.12PTA—PCH Temperature Adjust................................................................ 856
22.2.13MGTA—Memory Controller/Graphics Temperature Adjust............................ 856
22.2.14TRC—Thermal Reporting Control ............................................................. 857
22.2.15TES—Turbo Interrupt Status (Mobile Only) ............................................... 858
22.2.16TEN—Turbo Interrupt Enable (Mobile Only) .............................................. 858
22.2.17PSC—Power Sharing Configuration (Mobile Only) ...................................... 858
22.2.18CTV1—Core Temperature Value 1 ........................................................... 858
22.2.19CTV2—Core Temperature Value 2 ........................................................... 859
22.2.20CEV1—Core Energy Value ...................................................................... 859
22.2.21AE—Alert Enable................................................................................... 859
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Datasheet
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