ADP5020(RevA) Просмотр технического описания (PDF) - Analog Devices

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ADP5020
(Rev.:RevA)

Power Management Unit for Imaging Modules

Analog Devices 

ADP5020

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

VDD1, VDD2, VDD3

SW1, SW2

VOUT1, VOUT2, VOUT3

VDD_IO

EN, SCL, SDA, SYNC, XSHTDN

Operating Temperature Range

Ambient

Junction

Storage Temperature Range

Lead Temperature

Soldering (10 sec)

Vapor Phase (60 sec)

Infrared (15 sec)

VESD

Machine Model Range

Human Body Model Range

Charged Device Model

Rating

−0.3 V to +6 V

−0.3 V to +6 V

−0.3 V to +6 V

−0.3V to +3.6 V

−0.3 V to VDD_IO + 0.3 V

−40°C to +85°C

−40°C to +125°C

−65°C to +150°C

260°C

260°C

215°C

220°C

−200 V to +200 V

−2000 V to +2000 V

±750 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

The ADP5020 can be damaged when the junction temperature

(TJ) limits are exceeded. Monitoring the ambient temperature

does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

have to be derated. In applications having moderate power dissipa-

tion and low PCB thermal resistance, the maximum ambient

temperature can exceed the maximum limit as long as the junction

temperature is within specification limits. The TJ of the device is

dependent on the ambient temperature (TA), the power dissipation

(PD) of the device, and the junction-to-ambient thermal resistance

of the package (θJA). Maximum TJ is calculated from TA and PD

using the following formula:

TJ = TA + (PD × θJA)

Data Sheet

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 8. Thermal Resistance

Package Type

θJA

θJC

CP-20-10

47.4

4.3

Unit

°C/W

Thermal Data

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high maxi-

mum power dissipation exists, attention to thermal board design

is required. The value of θJA may vary, depending on PCB material,

layout, and environmental conditions. The specified value of θJA

is based on a 4-layer, 4 in × 3 in, 2 1/2 oz copper board, as per

JEDEC standards. For more information, see the AN-772

Application Note, A Design and Manufacturing Guide for the

Lead Frame Chip Scale Package (LFCSP).

ESD CAUTION

Rev. A | Page 8 of 28

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