MCF5275LCVM133 Просмотр технического описания (PDF) - Freescale Semiconductor

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MCF5275LCVM133

Integrated Microprocessor Family Hardware Specification

Freescale Semiconductor 

Preliminary Electrical Characteristics

5 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

in conformance with Psi-JT.

The average chip-junction temperature (TJ) in °C can be obtained from:

TJ = TA + (PD × ΘJMA) (1)

Where:

TA

ΘJMA

PD

PINT

PI/O

= Ambient Temperature, °C

= Package Thermal Resistance, Junction-to-Ambient, °C/W

= PINT + PI/O

= IDD × VDD, Watts - Chip Internal Power

= Power Dissipation on Input and Output Pins — User Determined

For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is

neglected) is:

PD = K ÷ (TJ + 273°C) (2)

Solving equations 1 and 2 for K gives:

K = PD × (TA + 273 °C) + ΘJMA × PD 2 (3)

where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at

equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1)

and (2) iteratively for any value of TA.

8.3

ESD Protection

Table 9. ESD Protection Characteristics1, 2

Characteristics

Symbol

Value

Units

ESD Target for Human Body Model

HBM

2000

V

ESD Target for Machine Model

MM

200

V

HBM Circuit Description

Rseries

C

1500

Ω

100

pF

MM Circuit Description

Rseries

C

0

Ω

200

pF

Number of pulses per pin (HBM)

positive pulses

negative pulses

—

—

1

—

1

Number of pulses per pin (MM)

positive pulses

negative pulses

—

—

3

—

3

Interval of Pulses

—

1

sec

1 All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive

Grade Integrated Circuits.

2 A device is defined as a failure if after exposure to ESD pulses the device no longer meets the

device specification requirements. Complete DC parametric and functional testing is

performed per applicable device specification at room temperature followed by hot

temperature, unless specified otherwise in the device specification.

MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2

20

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

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