MCF5275LCVM133 Просмотр технического описания (PDF) - Freescale Semiconductor
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MCF5275LCVM133 Datasheet PDF : 44 Pages
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Mechanicals/Pinouts
6.3 196 MAPBGA Pinout
Figure 5 is a consolidated MCF5274L/75L pinout for the 196 MAPBGA package. Table 2 lists the signals
by group and shows which signals are muxed and bonded on each of the device packages.
1
2
3
4
5
6
7
8
9
10
11
A NC
FEC0_
CRS
FEC0_
MDIO
U0RXD
U0TXD
U1RXD I2C_SCL
A23
CS6
CS5
A15
B
FEC0_
RXD2
FEC0_
RXD1
FEC0_
RXCLK
FEC0_
COL
U0RTS U1RTS I2C_SDA
A22
A20
A16
A13
C
FEC0_
TXCLK
FEC0_
TXER
FEC0_
TXEN
FEC0_
RXDV
FEC0_
MDC
U0CTS
U1CTS
A21
A18
A17
A14
D
FEC0_
TXD3
FEC0_
TXD0
FEC0_
TXD1
FEC0_
RXD3
FEC0_
RXD0
VDD
U1TXD
CS7
A19
CS4
A11
E
DT0IN
DT0OUT
FEC0_
TXD2
FEC0_
RXER
OVDD
OVDD
OVDD SD_VDD2 SD_VDD2 SD_VDD2
A6
12
13
14
A12
SD_
VREF
NC A
CS3
A9
TSIZ1 B
A10
A8
CS2 C
A7
A5
A2 D
A4
A1
TSIZ0 E
F DT1IN DT1OUT DT2IN DT2OUT OVDD OVDD
VSS
VSS SD_VDD2 SD_VDD2 A3 USB_CLK A0
IRQ7 F
G DT3OUT DT3IN SD_CAS SD_WE VDD
VSS
VSS
VSS
VSS
SD_VDD2
USB_
SPEED
VDD
IRQ6
IRQ5 G
H SD_SRAS TS SD_CS1 OE SD_VDD1 VSS
VSS
VSS
VSS
OVDD
IRQ4
IRQ2 USB_RN IRQ3 H
J SD_CKE SD_DQS3 D31
D22 SD_VDD1 SD_VDD1 VSS
VSS
OVDD OVDD USB_RP USB_TP IRQ1 USB_TN J
K BS3
L D30
M D27
N D20
P NC
1
D29
D28
D23 SD_VDD1 SD_VDD1 SD_VDD1 OVDD
OVDD
OVDD TDO/DSO RESET
USB_
TXEN
TA K
D26
D25
D24
BS2
R/W
VDD
PST2
DDATA0
QSPI_
DOUT
QSPI_CLK RSTOUT
VSSPLL USB_RXD L
D21
D18
D17
SD_CS0 RCON DDATA3 PST1
QSPI_
CS0
QSPI_DIN CLKMOD1 TDI/DSI
VDDPLL
EXTAL M
D19
D16 SD_A10 CS0
TEST DDATA2 PST0
QSPI_
CS2
QSPI_
CS1
CLKMOD0 TMS/BKPT
USB_
SUSP
XTAL N
SD_
VREF
SD_DQS2
CS1
DDR_CLK DDR_CLK
OUT
OUT
PST3
DDATA1 CLKOUT
QSPI_
CS3
JTAG_EN
TCLK/PST TRST/DSC
CLK
LK
NC
P
2
3
4
5
6
7
8
9
10
11
12
13
14
Figure 5. MCF5274L and MCF5275L Pinout (196 MAPBGA)
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2
16
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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