MCF5275LCVM133 Просмотр технического описания (PDF) - Freescale Semiconductor

Номер в каталоге

Компоненты Описание

производитель

MCF5275LCVM133

Integrated Microprocessor Family Hardware Specification

Freescale Semiconductor 

6.4 Package Dimensions - 196 MAPBGA

Figure 6 shows MCF5275 196 MAPBGA package dimensions.

Mechanicals/Pinouts

X

D

Y

Laser mark for pin 1

identification in

this area

NOTES:

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances

per ASME Y14.5M, 1994.

M

3. Dimension b is measured at the

maximum solder ball diameter,

K

parallel to datum plane Z.

4. Datum Z (seating plane) is defined

by the spherical crowns of the solder

balls.

5. Parallelism measurement shall

exclude any effect of mark on top

surface of package.

E

TOL

14 13 12 11 10 9

13X e

S

654 32 1

S

13X e

3

196X

b

0.15 Z X Y

0.08 Z

View M-M

Millimeters

DIM

Min

Max

A

1.25

1.60

A1 0.27

0.47

A2

1.16 REF

M

b

0.45

0.55

D

15.00 BSC

E

15.00 BSC

Metalized mark for

pin 1 identification

in this area

e

1.00 BSC

S

0.50 BSC

A

B

C

D

5

E

F

A A2

G

0.20 Z

H

J

K

A1

Z4

0.10 Z

196X

L

Detail K

M

Rotated 90° Clockwise

N

P

Figure 6. 196 MAPBGA Package Dimensions

MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2

Freescale Semiconductor

Preliminary—Subject to Change Without Notice

17

Share Link: