IC9 Просмотр технического описания (PDF) - HIROSE ELECTRIC

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Компоненты Описание

производитель

IC9

Card Bus Socket Connectors

HIROSE ELECTRIC 

BPCB mounting pattern

BTemperature Profile

5 s.max

250

240ç

200

200ç

150

150ç

160ç

100

50

(30s)

25ç (60s)

(60 to 90s)

0

Preheating

start

60

120

(20 to 30s)

Soldering

Time(seconds)

Applicable Conditions

Reflow system : IR reflow

Solder

: Paste type 63 Sn/37 Pb

(Flux content 9 wt%)

Test board Glass epoxy 60mm x 60mm x 1.6 mm

Metal mask thickness: 0.15 mm

Recommended temperature profile.

The temperature may be slightly changed according to the

solder paste type and amount.

A51

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