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5364IUZ(2007) Просмотр технического описания (PDF) - Intersil

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Компоненты Описание
производитель
5364IUZ Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
EL5164, EL5165, EL5364
Ordering Information
PART NUMBER
PART MARKING
PACKAGE
PKG.
DWG. #
EL5164IS
5164IS
8 Ld SOIC (150 mil)
MDP0027
EL5164IS-T7*
5164IS
8 Ld SOIC (150 mil)
MDP0027
EL5164IS-T13*
5164IS
8 Ld SOIC (150 mil)
MDP0027
EL5164ISZ (Note)
5164ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5164ISZ-T7* (Note)
5164ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5164ISZ-T13* (Note)
5164ISZ
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5164IW-T7*
i
6 Ld SOT-23
MDP0038
EL5164IW-T7A*
i
6 Ld SOT-23
MDP0038
EL5164IWZ-T7* (Note)
BAMA
6 Ld SOT-23 (Pb-free)
MDP0038
EL5164IWZ-T7A* (Note)
BAMA
6 Ld SOT-23 (Pb-free)
MDP0038
EL5165IC-T7*
F
5 Ld SC-70 (1.25mm)
P5.049
EL5165IC-T7A*
F
5 Ld SC-70 (1.25mm)
P5.049
EL5165IW-T7*
b
5 Ld SOT-23
MDP0038
EL5165IW-T7A*
b
5 Ld SOT-23
MDP0038
EL5165IWZ-T7* (Note)
BANA
5 Ld SOT-23 (Pb-free)
MDP0038
EL5165IWZ-T7A* (Note)
BANA
5 Ld SOT-23 (Pb-free)
MDP0038
EL5364IS
EL5364IS
16 Ld SOIC (150 mil)
MDP0027
EL5364IS-T7*
EL5364IS
16 Ld SOIC (150 mil)
MDP0027
EL5364IS-T13*
EL5364IS
16 Ld SOIC (150 mil)
MDP0027
EL5364ISZ (Note)
EL5364ISZ
16 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5364ISZ-T7* (Note)
EL5364ISZ
16 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5364ISZ-T13* (Note)
EL5364ISZ
16 Ld SOIC (150 mil) (Pb-free)
MDP0027
EL5364IU
5364IU
16 Ld QSOP (150 mil)
MDP0040
EL5364IU-T7*
5364IU
16 Ld QSOP (150 mil)
MDP0040
EL5364IU-T13*
5364IU
16 Ld QSOP (150 mil)
MDP0040
EL5364IUZ (Note)
5364IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5364IUZ-T7* (Note)
5364IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5364IUZ-T13* ( Note)
5364IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5364IUZA (Note)
5364IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5364IUZA-T7* (Note)
5364IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
EL5364IUZA-T13* (Note)
5364IUZ
16 Ld QSOP (150 mil) (Pb-free)
MDP0040
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
2
FN7389.8
October 29, 2007

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