5364IUZ(2007) Просмотр технического описания (PDF) - Intersil

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Компоненты Описание

производитель

5364IUZ
(Rev.:2007)

600MHz Current Feedback Amplifiers with Enable

Intersil 

EL5164, EL5165, EL5364

Typical Performance Curves (Continued)

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.4

1.250W

SO16 (0.150”)

1.2

θJA = +80°C/W

1.0

0.8 909mW

0.6

435mW

0.4

SO8

θJA = +110°C/W

0.2

SOT23-5/6

θJA = +230°C/W

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.4

1.2

1.0

0.8 893mW

0.6

QSOP16

θJA = +112°C/W

0.4

0.2

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.0

0.9

0.8

0.7

0.6 625mW

0.5

0.4

0.3 391mW

SO8

θJA = +160°C/W

0.2

SOT23-5/6

0.1 θJA = +256°C/W

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.2

1.0 909mW

0.8

0.6

633mW

0.4

0.2

θJAθJQA= SS+=OO1+51P16811°0(6C0°C./1W/5W0”)

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

8

FN7389.8

October 29, 2007

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