ADM1276-3ACPZ-RL(Rev0) Просмотр технического описания (PDF) - Analog Devices
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производитель
ADM1276-3ACPZ-RL
(Rev.:Rev0)
(Rev.:Rev0)
Analog Devices
ADM1276-3ACPZ-RL Datasheet PDF : 48 Pages
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ADM1276
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VCC Pin
UV Pin
OV Pin
−0.3 V to +25 V
−0.3 V to +4 V
−0.3 V to +4 V
SS Pin
TIMER Pin
VCAP Pin
ISET Pin
LATCH Pin
−0.3 V to VCAP + 0.3 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +4 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +25 V
SCL Pin
SDA Pin
ADR Pin
ENABLE Pin
GPO2/ALERT2 Pin
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to VCAP + 0.3 V
−0.3 V to +25 V
−0.3 V to +25 V
PWRGD Pin
FLB Pin
VOUT Pin
GATE Pin (Internal Supply Only)1
SENSE+ Pin
SENSE− Pin
VSENSE (VSENSE+ − VSENSE−)
Continuous Current into Any Pin
Storage Temperature Range
Operating Temperature Range
Lead Temperature, Soldering (10 sec)
Junction Temperature
−0.3 V to +25 V
−0.3 V to +25 V
−0.3 V to +25 V
−0.3 V to +36 V
−0.3 V to +25 V
−0.3 V to +25 V
±0.3 V
±10 mA
−65°C to +125°C
−40°C to +85°C
300°C
150°C
1 The GATE pin has internal clamping circuits to prevent the GATE pin voltage
from exceeding the maximum ratings of a MOSFET with VGSMAX = 20 V and
internal process limits. Applying a voltage source to this pin externally may
cause irreversible damage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
20-lead LFCSP (CP-20-9) 30.4
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 8 of 48
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