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ADF4157BCPZ-RL7(Rev0) Просмотр технического описания (PDF) - Analog Devices

Номер в каталоге
Компоненты Описание
производитель
ADF4157BCPZ-RL7
(Rev.:Rev0)
ADI
Analog Devices ADI
ADF4157BCPZ-RL7 Datasheet PDF : 20 Pages
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ADF4157
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, GND = AGND = DGND = 0 V, VDD = AVDD = DVDD, unless otherwise noted.
Table 3.
Parameter
VDD to GND
VDD to VDD
VP to GND
VP to VDD
Digital I/O Voltage to GND
Analog I/O Voltage to GND
REFIN, RFIN to GND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Maximum Junction Temperature
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Rating
−0.3 V to +4 V
−0.3 V to +0.3 V
−0.3 V to +5.8 V
−0.3 V to +5.8 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +85°C
−65°C to +125°C
150°C
260°C
40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
TSSOP
112
LFCSP (Paddle Soldered)
30.4
Unit
°C/W
°C/W
ESD CAUTION
Rev. 0 | Page 5 of 20

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