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MAX19700 Просмотр технического описания (PDF) - Maxim Integrated

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MAX19700 Datasheet PDF : 32 Pages
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7.5Msps, Ultra-Low-Power
Analog Front-End
Table 1. Output Codes vs. Input Voltage
DIFFERENTIAL INPUT
VOLTAGE
VREF x 512/512
VREF x 511/512
VREF x 1/512
VREF x 0/512
-VREF x 1/512
-VREF x 511/512
-VREF x 512/512
DIFFERENTIAL INPUT (LSB)
511 (+Full Scale – 1 LSB)
510 (+Full Scale – 2 LSB)
+1
0 (Bipolar Zero)
-1
-511 (-Full Scale +1 LSB)
-512 (-Full Scale)
OFFSET BINARY (D0–D9)
11 1111 1111
11 1111 1110
10 0000 0001
10 0000 0000
01 1111 1111
00 0000 0001
00 0000 0000
OUTPUT DECIMAL CODE
1023
1022
513
512
511
1
0
and IAN, as well as QAP and QAN, and set the input
signal common-mode voltage within the ADC range of
VDD/ 2 (±200mV) for optimum performance.
ADC System Timing Requirements
Figure 3 shows the relationship between the clock, ana-
log inputs, DR indicator, and the resulting output data.
Channel I (CHI) and channel Q (CHQ) are sampled on
the rising edge of the clock signal (CLK) and the result-
ing data is multiplexed at the D0–D9 outputs. CHI data
is updated on the rising edge and CHQ data is updat-
ed on the falling edge of the CLK. The DR indicator fol-
lows CLK with a typical delay time of 8.5ns and remains
high when CHI data is updated and low when CHQ
data is updated. Including the delay through the output
11 1111 1111
11 1111 1110
11 1111 1101
1 LSB = 2 x VREF
1024
VREF
VREF = VREFP - VREFN
VREF
10 0000 0001
10 0000 0000
01 1111 1111
(COM)
00 0000 0011
00 0000 0010
00 0000 0001
00 0000 0000
-512 -511 -510 -509
-1 0+ 1
(COM)
INPUT VOLTAGE (LSB)
+509 +510 +511 +512
Figure 2. ADC Transfer Function
latch, the total clock-cycle latency is 5 clock cycles for
CHI and 5.5 clock cycles for CHQ.
Digital Input/Output Data (D0–D9)
D0–D9 are the Rx ADC digital logic outputs when the
MAX19700 is in receive mode. This bus is shared with
the Tx DAC digital logic inputs and operates in half-
duplex mode. D0–D9 are the Tx DAC digital logic
inputs when the MAX19700 is in transmit mode. The
logic level is set by OVDD from 1.8V to VDD. The digital
output coding is offset binary (Table 1). Keep the
capacitive load on the digital outputs D0–D9 as low as
possible (<15pF) to avoid large digital currents feeding
back into the analog portion of the MAX19700 and
degrading its dynamic performance. Buffers on the dig-
ital outputs isolate the outputs from heavy capacitive
loads. Adding 100resistors in series with the digital
outputs close to the MAX19700 will help improve ADC
performance. See the MAX19700EVKIT schematic for
an example of the digital outputs driving a digital buffer
through 100series resistors.
During SHDN, IDLE, and STBY states, the pins D0–D9
are internally pulled up to prevent floating digital inputs.
To ensure no current flows through D0–D9 I/O, the
external bus needs to be either tri-stated or pulled up to
OVDD and should not be pulled to ground.
Dual 10-Bit Tx DAC and Transmit Path
The dual 10-bit digital-to-analog converters (Tx DAC)
operate with clock speeds up to 7.5MHz. The Tx DAC
digital inputs, D0–D9, are multiplexed on a single 10-bit
bus. The voltage reference determines the Tx path full-
scale output voltage. See the Reference Configurations
section for details on setting the reference voltage. Each
Tx path channel integrates a lowpass filter tuned to
meet the TD-SCDMA spectral mask requirements. The
TD-SCDMA filters are tuned for 1.27MHz cutoff frequen-
cy and >55dB image rejection at fIMAGE = 4.32MHz,
fOUT = 800kHz, and fCLK = 5.12MHz. See Figure 4 for
an illustration of the filter frequency response.
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