12.6 Package
12.6.1 Recommended Soldering Conditions
12.6.1.1 MQFP(Metric Quad Flat Pack ) Type
HMS30C7202N
- Recommended IP-Reflow Solder Machine Temperature
12.6.1.2 FBGA(Chip Array Ball Grid Array) Type
The soldering condition of FBGA type package is the same as that of MQFP type package.
- Recommended IP-Reflow Solder Machine Temperature
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Version 1.1