SMP75-8 Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание

производитель

SMP75-8

TRISIL™ FOR TELECOM EQUIPMENT PROTECTION

STMicroelectronics 

SMP75-8

Figure 13: SMB Package Mechanical data

E1

D

E

A1

C

A2

L

b

REF.

A1

A2

b

c

E

E1

D

L

DIMENSIONS

Millimeters

Inches

Min. Max. Min. Max.

1.90

2.45 0.075 0.096

0.05

0.20 0.002 0.008

1.95

2.20 0.077 0.087

0.15

0.41 0.006 0.016

5.10

5.60 0.201 0.220

4.05

4.60 0.159 0.181

3.30

3.95 0.130 0.156

0.75

1.60 0.030 0.063

Figure 14: Foot Print Dimensions (in millimeters)

2.3

1.52

2.75

1.52

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.

Table 6: Ordering Information

Part Number

Marking

SMP75-8

L08

Package

SMB

Weight

0.11 g

Base qty

2500

Delivery mode

Tape & reel

Table 7: Revision History

Date

Revision

19-July-2005

3

02-Jan-2006

4

Description of Changes

Previous issue

Added ECOPACK statement and changed page layout.

Minor updates to technical values in Tables 2, 3, and 5.

7/8

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