Philips Semiconductors
NPN 6 GHz wideband transistor
PACKAGE OUTLINE
Studded ceramic package; 4 leads
A
Q
N2
N
N3
D
c
D1
A
D2
w1 M A
X
H
b
4
b1
H
1
3
Product specification
BFQ270
SOT172A1
M
W
M1
detail X
2
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
b1
c
D
D1 D2
H
M
M1
N
N2 N3
Q
W w1
mm
5.31
4.34
3.31
3.04
0.89
0.63
0.16
0.10
5.20
4.95
5.33
5.08
5.33 26.17
5.08 24.63
inches
0.209
0.171
0.130
0.120
0.035
0.025
0.006
0.004
0.205
0.195
0.210
0.200
0.210
0.200
1.03
0.97
3.05
2.79
0.12
0.11
1.66 11.82 8.89 3.69 2.90
1.39 10.89 6.90 2.92 2.31
0.065 0.465 0.350 0.145 0.114
0.055 0.429 0.272 0.115 0.091
8-32
UNC
0.38
0.015
OUTLINE
VERSION
IEC
SOT172A1
September 1995
REFERENCES
JEDEC
EIAJ
11
EUROPEAN
PROJECTION
ISSUE DATE
97-06-28