TGF4112 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGF4112 Datasheet PDF : 9 Pages
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Thermal Model of TGF4112-EPU
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Predicted Channel Temperature vs Base Plate Temperature
With a .020" CM15 (15/85 Copper Molybdenum) carrier plate
solder attached using 0.0015" AuSn (80/20) solder
Pd = 3.5 Watts
Pd = 7 Watts
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Base Plate Temperature (°C)
Tch = 1.67 + 9.72 x Pd + 0.288 x Pd 2 + (1.00 + 0.0289 x Pd + 0.000544 x Pd 2) x Tbase
(Predicted Channel Temperature equation for the given assembly stack up)
This model assumes a perfect solder connection (no voids) between the FET and the carrier plate.
HFET Channel Temperature vs Median Life
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Median Life (10^X Hours)
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