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STB30NS15 Просмотр технического описания (PDF) - STMicroelectronics

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STB30NS15 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
STB30NS15
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
1.36
Rthj-amb Thermal Resistance Junction-ambient
Max
62.5
Tl
Maximum Lead Temperature For Soldering Purpose
300
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
150
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20V
°C/W
°C/W
°C
Max.
Unit
V
1
µA
10
µA
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
ID = 15 A
Min.
2
Typ.
3
0.075
Max.
4
0.1
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 20 V
ID = 15 A
VDS = 25V f = 1 MHz VGS = 0
Min.
Typ.
8
990
175
110
Max.
Unit
S
pF
pF
pF
2/9

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