STD25NF10 Просмотр технического описания (PDF) - STMicroelectronics
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STD25NF10
STMicroelectronics
STD25NF10 Datasheet PDF : 9 Pages
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STD25NF10
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max
1.5
Rthj-amb Thermal Resistance Junction-ambient Max
100
Tl
Maximum Lead Temperature For Soldering Purpose
300
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
100
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ±20V
±100
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS, ID = 250µA
VGS = 10V, ID = 12.5 A
Min.
2
Typ.
3
0.033
Max.
4
0.038
Unit
V
Ω
DYNAMIC
Symbol
gfs (1)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V, ID = 12.5 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
20
1550
220
95
Max.
Unit
S
pF
pF
pF
2/9
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