TQ1089-MC700 Просмотр технического описания (PDF) - TriQuint Semiconductor
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Компоненты Описание
производитель
TQ1089-MC700 Datasheet PDF : 10 Pages
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TQ1089
Table 6. Above-VDD and Below-Ground Characteristics Table 9. Rise and Fall Times
(Into 0 pF, 50 Ohms to 1.5 V)
Diode to GND␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣
V
I (mA)
0.0
0
–0.4
0
–0.5
0
–0.6
–5
–0.7
–15
–0.8
–35
–0.9
–55
–1.0
–75
–2.0
–300
–2.5
–350
–3.0
–360
Diode Stack to VDD
V
I (mA)
5.0
0
5.4
0
5.5
0
5.6
5
5.7
15
5.8
35
5.9
55
6.0
75
7.0
300
7.5
350
8.0
360
Note: TriQuint does not guarantee diode operation for purposes
other than ESD protection.
Figure 11. Output Model
L1
L2
DIE
C1
C2
OUTPUT
Table 7. Device and Bond-Wire Characteristics
(Estimated)
L1
C1
2 nH
10 pF
Table 8. 28-Pin MQuad Package Characteristics
L2
1.85 nH
C2
0.40 pF
Time (ns) TR min (V) TR max (V)
0.0
0.15
0.32
0.1
0.15
0.32
0.2
0.16
0.32
0.3
0.18
0.32
0.4
0.23
0.32
0.5
0.26
0.32
0.6
0.34
0.32
0.7
0.46
0.34
0.8
0.67
0.39
0.9
0.89
0.49
1.0
1.12
0.63
1.1
1.32
0.86
1.2
1.50
1.09
1.3
1.73
1.27
1.4
1.93
1.45
1.5
2.15
1.64
1.6
2.75
2.23
1.7
2.58
2.00
1.8
2.75
2.23
1.9
2.90
2.41
2.0
3.02
2.50
2.1
3.12
2.64
2.2
3.17
2.77
2.3
3.19
2.86
2.4
3.20
2.95
2.5
3.20
2.99
2.6
3.20
3.02
2.7
3.20
3.02
2.8
3.20
3.04
2.9
3.20
3.04
3.0
3.20
3.04
3.1
3.20
3.04
3.2
3.20
3.04
3.3
3.20
3.04
3.4
3.20
3.04
3.5
3.20
3.04
TF min (V) TF max (V)
3.20
3.04
3.20
3.04
3.06
2.95
2.86
2.90
2.62
2.68
2.38
2.50
2.17
2.36
2.00
2.22
1.85
2.09
1.69
1.95
1.52
1.86
1.38
1.68
1.26
1.59
1.12
1.49
0.96
1.36
0.83
1.23
0.52
0.95
0.61
1.00
0.52
0.95
0.45
0.91
0.39
0.86
0.33
0.77
0.29
0.73
0.24
0.68
0.21
0.64
0.19
0.59
0.17
0.55
0.16
0.53
0.16
0.50
0.15
0.45
0.15
0.41
0.15
0.40
0.15
0.37
0.15
0.36
0.15
0.32
0.15
0.32
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