A9212A Просмотр технического описания (PDF) - AMIC Technology
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A9212A Datasheet PDF : 16 Pages
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Ver 1.0
Gold Bump Specification
A9212-A
13.56MHz RFID TAG IC
․ Bump material:
>99.9% pure Au
․ Bump hardness:
35 – 80 HV 0.005
․ Bump shear strength:
>70MPa
․ Bump height:
15 3um
․ Bump height uniformly:
– Within a die
2 um
– Within a wafer
3 um
– Wafer to wafer
4 um
․ Bump flatness:
1.5 um
․ Bump size:
– ANTP, ANTM, TIO1,
TIO2, TIO3:
– Variation:
ANTP, ANTM: 80um x 80um;
TIO1, TIO2, TIO3: 60um x 60um
5 um
․ Under bump metallization: Sputtered TiW
p11 of 16
Ver. 1.0
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