A9211B Просмотр технического описания (PDF) - AMIC Technology
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A9211B Datasheet PDF : 15 Pages
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A9211B
ISO/IEC 14443A RFID TAG IC
11. Gold Bump Specification
․ Bump material:
>99.9% pure Au
․ Bump hardness:
35 – 80 HV 0.005
․ Bump shear strength:
>70MPa
․ Bump height:
18um
․ Bump height uniformly:
– Within a die
± 2 um
– Within a wafer
± 3 um
– Wafer to wafer
± 4 um
․ Bump flatness:
± 1.5 um
․ Bump size:
– ANTP, ANTM:
80um x 80um;
– TIO0 TIO1, TIO2:
50um x 50um
– Variation:
± 5 um
․ Under bump metallization: Sputtered TiW
p11 of 15
Ver. 1.0
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