A9211B Просмотр технического описания (PDF) - AMIC Technology
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A9211B Datasheet PDF : 15 Pages
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A9211B
ISO/IEC 14443A RFID TAG IC
10. Mechanical Specification
․ Wafer diameter:
․ Wafer thickness:
․ Backside material:
․ Backside treatment:
․ Backside roughness:
․ Chip size:
․ Scribe line:
․ Passivation type:
․ Passivation material:
․ Passivation Thickness:
8”
Raw wafer (150um ± 15 um)
Si
Etched; to achieve 30~50% brightness relative to surface
Not specified
1073.68um x 972.26um
100um
PSG and SIN
PSG and SIN
PSG2.5K Å and SIN 3K Å
p10 of 15
Ver. 1.0
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