ENWC9B01A1EF Просмотр технического описания (PDF) - Panasonic Corporation

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ENWC9B01A1EF

IEEE® 802.15.4 and Bluetooth® Low Energy Module

Panasonic Corporation 



802.15.4 and Bluetooth LE Module

Table of Contents

1 About This Document.........................................................................................................................6

1.1 Purpose and Audience ..............................................................................................................6

1.2 Revision History.........................................................................................................................6

1.3 Use of Symbols .........................................................................................................................6

1.4 Related Documents ...................................................................................................................6

2 Overview..............................................................................................................................................7

2.1 Block Diagram ...........................................................................................................................8

2.2 Pin Configuration .......................................................................................................................9

2.3 Transceiver Features...............................................................................................................13

3 Detailed Description .........................................................................................................................16

3.1 Dimensions..............................................................................................................................16

3.2 Footprint ..................................................................................................................................17

3.3 Packaging................................................................................................................................18

3.4 Case Marking ..........................................................................................................................21

3.5 Production Data Storage .........................................................................................................22

4 Specification .....................................................................................................................................23

4.1 Default Test Conditions ...........................................................................................................23

4.2 Absolute Maximum Ratings .....................................................................................................23

4.3 Recommended Operating Conditions......................................................................................24

4.4 Current Consumption...............................................................................................................24

4.5 Internal Operating Frequencies ...............................................................................................25

4.6 Interface Specification .............................................................................................................25

4.7 Flash Electrical Specifications .................................................................................................40

4.8 General Switching Specification ..............................................................................................41

4.9 Transceiver Feature Summary ................................................................................................43

4.10 Reliability Tests .......................................................................................................................45

4.11 Recommended Soldering Profile .............................................................................................46

5 Cautions ............................................................................................................................................47

5.1 Design Notes ...........................................................................................................................47

5.2 Installation Notes .....................................................................................................................47

5.3 Usage Condition Notes............................................................................................................48

5.4 Storage Notes..........................................................................................................................48

5.5 Safety Cautions .......................................................................................................................48

5.6 Other Cautions ........................................................................................................................49

5.7 Restricted Use .........................................................................................................................50

6 Regulatory and Certification Information .......................................................................................51

6.1 Federal Communications Commission (FCC) for US ..............................................................51

6.2 Innovation, Science, and Economic Development (ISED) for Canada ....................................54

6.3 European Conformity According to RED (2014/53/EU) ...........................................................56

6.4 Bluetooth .................................................................................................................................57

6.5 RoHS and REACH Declaration ...............................................................................................58

Product Specification Rev. 1.1

Page 4

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