PE24B-0603 Просмотр технического описания (PDF) - Unspecified

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PE24B-0603

The best ESD protection for high frequency, low voltage applications

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PE24B-0603

Solder Reflow Recommendation

Item Process

Description

Reach Temp. Time or Rate

A Soak Start From ambient to soak temperature and soak start 150℃ - 180℃ 2℃ - 4℃ / sec

B Soak time Soak time

---

60s - 120s

C Soak end Soak end

180℃ - 200℃

---

D Peak Temp. From soak temperature to Peak temperature

260℃

2℃ - 3℃ / sec

E Time above Main heating time

230℃ - 260℃

40s - 60s

F Cooling

From main heating temperature to 100℃

100℃

Max. 4℃ / sec

Notes:

1* Peak temperature can be high to 260℃, and the recommendation time is as below

at 230℃

40s ~ 60s

at 240℃

30s ~ 40s

at 260℃

5s ~ 10s

2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder.

3* Devices can be cleaned using standard industry methods and solvents.

4* Component can withstand 270℃ 10 sec.

5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

Package Information

Tape & Reel: 5000pcs per reel.

2009. 02. 17

Revision No : 1

4/4

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