ADXL357 Просмотр технического описания (PDF) - Analog Devices

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ADXL357

Low Noise, Low Drift, Low Power, 3-Axis MEMS Accelerometers

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Acceleration (Any Axis, 0.1 ms)

Unpowered

Powered

VSUPPLY, VDDIO

V1P8ANA, V1P8DIG Configured as Inputs

ADXL356

Digital Inputs (RANGE, ST1, ST2, STBY)

Analog Outputs (XOUT, YOUT, ZOUT, TEMP)

ADXL357

Digital Pins (CS/SCL, SCLK/VSSIO,

MOSI/SDA, MISO/ASEL, INT1, INT2,

DRDY)

Operating Temperature Range

Storage Temperature Range

Rating

10,000 g

10,000 g

5.4 V

1.98 V

−0.3 V to VDDIO + 0.3 V

−0.3 V to V1P8ANA + 0.3 V

−0.3 V to VDDIO + 0.3 V

−40°C to +125°C

−55°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. ψJB is

the junction to board thermal resistance.

Table 6. Thermal Resistance

Package Type

θJA

ψJB

E-14-11

42

17.6

Unit

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board with four thermal vias. See JEDEC JESD51.

ADXL356/ADXL357

RECOMMENDED SOLDERING PROFILE

Figure 5 and Table 7 provide details about the recommended

soldering profile.

CRITICAL ZONE

TP

tP

TL TO TP

RAMP-UP

TL

TSMAX

tL

TSMIN

tS

PREHEAT

RAMP-DOWN

t25°C TO PEAK

TIME

Figure 5. Recommended Soldering Profile

Table 7. Recommended Soldering Profile

Condition

Profile Feature

Sn63/Pb37 Pb-Free

Average Ramp Rate from Liquid

Temperature (TL) to Peak

Temperature (TP)

Preheat

Minimum Temperature

(TSMIN)

Maximum Temperature

(TSMAX)

Time from TSMIN to TSMAX (tS)

TSMAX to TL Ramp-Up Rate

Liquid Temperature (TL)

Time Maintained Above TL (tL)

Peak Temperature (TP)

Time of Actual TP − 5°C (tP)

Ramp-Down Rate

Time from 25°C to Peak

Temperature (t25°C TO PEAK)

3°C/sec

maximum

100°C

150°C

60 sec to

120 sec

3°C/sec

maximum

183°C

60 sec to

150 sec

240°C +

0°C/−5°C

10 sec to

30 sec

6°C/sec

maximum

6 minutes

maximum

3°C/sec

maximum

150°C

200°C

60 sec to

180 sec

3°C/sec

maximum

217°C

60 sec to

150 sec

260°C +

0°C/−5°C

20 sec to

40 sec

6°C/sec

maximum

8 minutes

maximum

ESD CAUTION

Rev. A | Page 9 of 42

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