FSV12120V Просмотр технического описания (PDF) - ON Semiconductor
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FSV12120V Datasheet PDF : 5 Pages
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FSV12120V
THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1)
Symbol
Parameter
Minimum
Maximum
Land Pattern Land Pattern Unit
RqJA Junction−to−Ambient Thermal Resistance
100
ΨJL
Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode
15
40
°C/W
12
°C/W
Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode
6
5
1. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1
and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2).
Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.
F
S
F
S
F
F
S
S
F
S
Figure 1. Minimum Land Pattern of 2 oz Copper
Figure 2. Maximum Land Pattern of 2 oz Copper
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
BVR Breakdown Voltage
VF
Forward Voltage Drop
IR = 0.5 mA
IF = 12 A
120
−
−
V
−
0.739
0.790
V
IR
Reverse Current
VR = 120 V
−
5.5
25
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
ORDERING INFORMATION
Part Number
Top Mark
Package
Shipping†
FSV12120V
FSV12120V
TO−277 3L
(Pb−Free/Halogen Free)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
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