SZMMSZ4694T1G(2018) Просмотр технического описания (PDF) - ON Semiconductor
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SZMMSZ4694T1G Datasheet PDF : 7 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 5:1
SOD−123
CASE 425−04
ISSUE G
DATE 07 OCT 2009
D
ÂÂÂÂÂÂ1 ÂÂÂÂÂÂ
HE
E
A
A1
2
q
b
L
C
SOLDERING FOOTPRINT*
0.91
ÉÉÉÉÉÉÉÉÉ 0.036
ÉÉÉÉÉÉÉÉÉ
1.22
0.048
2.36
0.093
4.19
0.165
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.94 1.17 1.35 0.037 0.046 0.053
A1 0.00 0.05 0.10 0.000 0.002 0.004
b 0.51 0.61 0.71 0.020 0.024 0.028
c --- --- 0.15 --- --- 0.006
D 1.40 1.60 1.80 0.055 0.063 0.071
E 2.54 2.69 2.84 0.100 0.106 0.112
HE 3.56 3.68 3.86 0.140 0.145 0.152
L 0.25 --- --- 0.010 --- ---
q
0° --- 10°
0° --- 10°
GENERIC
MARKING DIAGRAM*
1
XXXMG
G
XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data
sheet for actual part marking. Pb−Free indicator, “G” or
microdot “ G”, may or may not be present.
STYLE 1:
PIN 1. CATHODE
2. ANODE
DOCUMENT NUMBER: 98ASB42927B
DESCRIPTION: SOD−123
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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