SZMMSZ4690T3G(2018) Просмотр технического описания (PDF) - ON Semiconductor
Номер в каталоге
Компоненты Описание
производитель
SZMMSZ4690T3G Datasheet PDF : 7 Pages
| |||
MMSZ4xxxT1G Series,
SZMMSZ4xxxT1G Series
Zener Voltage Regulators
500 mW, Low IZT SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 1.8 V to 43 V
• Low Reverse Current (IZT) − 50 mA
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol Max
Units
Total Power Dissipation on FR−5 Board,
PD
(Note 1) @ TL = 75°C
500
mW
Derated above 75°C
6.7 mW/°C
Thermal Resistance, (Note 2)
Junction−to−Ambient
RqJA
°C/W
340
Thermal Resistance, (Note 2)
Junction−to−Lead
RqJL
°C/W
150
Junction and Storage Temperature Range TJ, Tstg −55 to
°C
+150
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
www.onsemi.com
SOD−123
CASE 425
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
1
xx M G
G
xx = Device Code (Refer to page 3)
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
MMSZ4xxxT1G
SOD−123
(Pb−Free)
SZMMSZ4xxxT1G SOD−123
(Pb−Free)
MMSZ4xxxT3G
SZMMSZ4xxxT3G
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
Shipping†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
10,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
April, 2018 − Rev. 12
Publication Order Number:
MMSZ4678T1/D
Share Link: 