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HMC272MS8(2001) Просмотр технического описания (PDF) - Hittite Microwave

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Компоненты Описание
производитель
HMC272MS8
(Rev.:2001)
Hittite
Hittite Microwave Hittite
HMC272MS8 Datasheet PDF : 6 Pages
1 2 3 4 5 6
MICROWAVE CORPORATION
HMC272MS8
HMC272MS8 SMT SINGLE-BALANCED MIXER 1.7 - 3 GHz
FEBRUARY 2001
Evaluation Circuit Board
4
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to
that shown below. A sufficient number of VIA holes should be used to connect the top and bottom ground planes.
The evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Layout Technique
Material
Dielectric Thickness
50 Ohm Line Width
Gap to Ground Edge
Ground VIA Hole Diameter
Grounded Co-Planar Waveguide (GCPW)
FR4
0.028" (0.71 mm)
0.037" (0.94 mm)
0.010" (0.25 mm)
0.014" (0.36 mm)
Connectors
SMA-F ( EF - Johnson P/N 142-0701-806)
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
4 - 162
Web Site: www.hittite.com

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