HMC204 Просмотр технического описания (PDF) - Micross Components

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HMC204

GaAs MMIC PASSIVE FREQUENCY DOUBLER, 4 - 8 GHz INPUT

Micross Components 

v04.0907

HMC204

GaAs MMIC PASSIVE FREQUENCY

DOUBLER, 4 - 8 GHz INPUT

Absolute Maximum Ratings

Input Drive

Storage Temperature

+27 dBm

-65 to +150 °C

2

Operating Temperature

-55 to +85 °C

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Outline Drawing

Die Packaging Information [1]

Standard

Alternate

WP-2 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. DIE THICKNESS IS 0.100 [0.004], BACKSIDE IS GROUND

2. BOND PADS ARE 0.100 [0.004] SQUARE

3. BOND PAD SPACING, CTR-CTR: 0.150 [0.006]

4. ALL DIMENSION IN INCHES [MILLIMETERS]

5. ALL TOLERANCES ARE ±0.025 [±0.001]

6. BOND PAD METALLIZATION: GOLD

7. BACKSIDE METALLIZATION: GOLD

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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