K20P32M50SF0 Просмотр технического описания (PDF) - Freescale Semiconductor

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K20P32M50SF0

K20 Sub-Family

Freescale Semiconductor 

Table of Contents

1 Ordering parts...........................................................................3

5.4 Thermal specifications.......................................................21

1.1 Determining valid orderable parts......................................3

5.4.1 Thermal operating requirements...........................21

2 Part identification......................................................................3

5.4.2 Thermal attributes.................................................21

2.1 Description.........................................................................3

6 Peripheral operating requirements and behaviors....................22

2.2 Format...............................................................................3

6.1 Core modules....................................................................22

2.3 Fields.................................................................................3

6.1.1 JTAG electricals....................................................22

2.4 Example............................................................................4

6.2 System modules................................................................25

3 Terminology and guidelines......................................................4

6.3 Clock modules...................................................................25

3.1 Definition: Operating requirement......................................4

6.3.1 MCG specifications...............................................25

3.2 Definition: Operating behavior...........................................5

6.3.2 Oscillator electrical specifications.........................27

3.3 Definition: Attribute............................................................5

6.3.3 32 kHz Oscillator Electrical Characteristics...........29

3.4 Definition: Rating...............................................................6

6.4 Memories and memory interfaces.....................................30

3.5 Result of exceeding a rating..............................................6

6.4.1 Flash electrical specifications................................30

3.6 Relationship between ratings and operating

6.4.2 EzPort Switching Specifications............................34

requirements......................................................................6

6.5 Security and integrity modules..........................................35

3.7 Guidelines for ratings and operating requirements............7

6.6 Analog...............................................................................35

3.8 Definition: Typical value.....................................................7

6.6.1 ADC electrical specifications.................................35

3.9 Typical value conditions....................................................8

6.6.2 CMP and 6-bit DAC electrical specifications.........40

4 Ratings......................................................................................9

6.7 Timers................................................................................43

4.1 Thermal handling ratings...................................................9

6.8 Communication interfaces.................................................43

4.2 Moisture handling ratings..................................................9

6.8.1 USB electrical specifications.................................43

4.3 ESD handling ratings.........................................................9

6.8.2 USB DCD electrical specifications........................43

4.4 Voltage and current operating ratings...............................9

6.8.3 USB VREG electrical specifications......................44

5 General.....................................................................................10

6.8.4 DSPI switching specifications (limited voltage

5.1 AC electrical characteristics..............................................10

range)....................................................................44

5.2 Nonswitching electrical specifications...............................11

6.8.5 DSPI switching specifications (full voltage range).46

5.2.1 Voltage and current operating requirements.........11

6.8.6 I2C switching specifications..................................48

5.2.2 LVD and POR operating requirements.................11

6.8.7 UART switching specifications..............................48

5.2.3 Voltage and current operating behaviors..............12

6.8.8 I2S/SAI Switching Specifications..........................48

5.2.4 Power mode transition operating behaviors..........13

6.9 Human-machine interfaces (HMI)......................................52

5.2.5 Power consumption operating behaviors..............14

6.9.1 TSI electrical specifications...................................52

5.2.6 EMC radiated emissions operating behaviors.......18

7 Dimensions...............................................................................54

5.2.7 Designing with radiated emissions in mind...........19

7.1 Obtaining package dimensions.........................................54

5.2.8 Capacitance attributes..........................................19

8 Pinout........................................................................................54

5.3 Switching specifications.....................................................19

8.1 K20 Signal Multiplexing and Pin Assignments..................54

5.3.1 Device clock specifications...................................19

8.2 K20 Pinouts.......................................................................55

5.3.2 General switching specifications...........................20

9 Revision History........................................................................56

K20 Sub-Family Data Sheet, Rev. 4 5/2012.

2

Freescale Semiconductor, Inc.

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