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SCHA Просмотр технического описания (PDF) - ALPS ELECTRIC CO.,LTD.

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производитель
SCHA Datasheet PDF : 4 Pages
1 2 3 4
Small Memory Card Connectors
Soldering Conditions
For
SD Memory
Card
For
microSD™
Card
For
SIM Card
8pins
Example of Reflow Soldering ConditionReference
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CAKor CCT.
3. Temperature profileSurface of products).
200
For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
100
Room
temperature
Pre-heating
90±30 sec.
240(max.)
230(min.)
180
150
10 sec.(max.)
Time (s)
Combine Type
For
Compact
Flash™
For PC cards
supporting
CardBus
For
Express
Card™
For CMOS
Camera Module
Heating time
sec.
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
5. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.
50

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