RH1084MK Просмотр технического описания (PDF) - Linear Technology

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RH1084MK

5A Low Dropout Positive Adjustable Regulator

Linear Technology 

DICE/DWF SPECIFICATION

RH1084MK

Rad Hard die require special handling as compared to standard IC chips.

Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die surface

from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much “softer” than silicon nitride.

LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the

die around from the chip tray, use a Teflon-tipped vacuum wand. This wand can be made by pushing a small diameter Teflon tubing onto the tip of a

steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square and

flat to ensure good vacuum to die surface. Ensure the Teflon tip remains clean from debris by inspecting under stereoscope.

During die attach, care must be exercised to ensure no tweezers touch the top of the die.

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information

on dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.

I.D.No. 66-13-1084mk

2

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

(408) 432-1900 O FAX: (408) 434-0507 O www.linear.com

LT 0811 Rev A •• PRINTED IN USA

© LINEAR TECHNOLOGY CORPORATION 2008

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