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NCP1615

High Voltage High Efficiency Power Factor Correction Controller

ON Semiconductor 

NCP1615

Table 4. MAXIMUM RATINGS (Notes 8 and 9)

Rating

Pin

Symbol

Value

Unit

High Voltage Start−Up Circuit Input Voltage

High Voltage Feedback Input Voltage

High Voltage Feedback Input Current

Zero Current Detection and Current Sense Input Voltage (Note 10)

Zero Current Detection and Current Sense Input Current

Control Input Voltage (Note 11)

Supply Input Voltage

Fault Input Voltage

PSTimer Input Voltage

Driver Maximum Voltage (Note 12)

Driver Maximum Current

HV

HVFB

HVFB

CS/ZCD

CS/ZCD

Control

VCC

Fault

PSTimer

DRV

DRV

VHV

−0.3 to 700

V

VHVFB

−0.3 to 700

V

IHVFB

0.5

mA

VCS/ZCD −0.3 to VCS/ZCD(MAX)

V

ICS/ZCD

+5

mA

VControl

−0.3 to VControl(MAX)

V

VCC(MAX)

−0.3 to 28

V

VFault

−0.3 to (VCC + 0.6)

V

VPSTimer

−0.3 to (VCC + 0.6)

V

VDRV

−0.3 to VDRV

V

IDRV(SRC)

500

mA

IDRV(SNK)

800

Maximum Input Voltage (Note 13)

Maximum Operating Junction Temperature

Storage Temperature Range

Lead Temperature (Soldering, 10 s)

Moisture Sensitivity Level

Other Pins

VMAX

TJ

TSTG

TL(MAX)

MSL

−0.3 to 7

V

−40 to 150

°C

–60 to 150

°C

300

°C

1

−

Power Dissipation (TA = 70°C, 1 Oz Cu, 0.155 Sq Inch Printed Circuit

Copper Clad)

Plastic Package SOIC−14NB/SOIC−16NB

PD

mW

465

Thermal Resistance, (Junction to Ambient 1 Oz Cu Printed Circuit

Copper Clad)

Plastic Package SOIC−14NB/SOIC−16NB

ESD Capability (Note 14)

Human Body Model per JEDEC Standard JESD22−A114E.

Machine Model per JEDEC Standard JESD22−A114E.

Charge Device Model per JEDEC Standard JESD22−C101E.

RqJA

RqJC

172

68

> 2000

> 200

> 500

°C/W

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

5. All references to Version A include Versions A/A1, unless otherwise noted.

6. All references to Version C include Versions C/C2/C3, unless otherwise noted.

7. All references to Version D include Versions D/D2, unless otherwise noted.

8. This device contains Latch−Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.

9. Low Conductivity Board. As mounted on 80 x 100 x 1.5 mm FR4 substrate with a single layer of 50 mm2 of 2 oz copper traces and heat

spreading area. As specified for a JEDEC51−1 conductivity test PCB. Test conditions were under natural convection of zero air flow.

10. VCS/ZCD(MAX) is the CS/ZCD pin positive clamp voltage.

11. VControl(MAX) is the Control pin positive clamp voltage.

12. When VCC exceeds the driver clamp voltage (VDRV(high)), VDRV is equal to VDRV(high). Otherwise, VDRV is equal to VCC.

13. When the voltage applied to these pins exceeds 5.5 V, they sink a current about equal to (Vpin − 5.5 V) / (4 kW). An applied voltage of 7 V

generates a sink current of approximately 0.375 mA.

14. Pins HV, HVFB are rated to the maximum voltage of the part, or 700 V.

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