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FXL2T245

Low-Voltage, Dual-Supply, 2-Bit, Signal Translator with Configurable Voltage Supplies and Signal Levels and 3-State Outputs

ON Semiconductor 

April 2014

FXL2T245

Low-Voltage, Dual-Supply, 2-Bit, Signal Translator

with Configurable Voltage Supplies and Signal Levels

and 3-State Outputs

Features

 Bi-Directional Interface between any 2 Levels from

1.1 V to 3.6 V

 Fully Configurable, Inputs Track VCC Level

 Non-Preferential Power-up Sequencing; either VCC

maybe Powered-up First

 Outputs Remain in 3-State until Active VCC Level is

Reached

 Outputs Switch to 3-State if either VCC is at GND

 Power-Off Protection

 Control Inputs (T/R, OE) Levels are Referenced to

VCCA Voltage

 Packaged in 10-Lead MicroPak

(1.6 mm x 2.1 mm) Package

 ESD Protection Exceeds:

- 4 kV HBM ESD JESD22-A114 & Mil Std 883e

3015.7)

- 8kV HBM I/O to GND ESD (per JESD22-A114 &

Mil Std 883e 3015.7)

- 1 kV CDM ESD (per ESD STM 5.3)

- 200 V MM ESD (per JESD22-A115 & ESD

STM5.2)

Description

The FXL2T245 is a configurable, dual-voltage-supply

translator designed for uni-directional and bi-directional

voltage translation between two logic levels. The device

allows translation between voltages as high as 3.6 V to

as low as 1.1 V. The A port tracks the VCCA level and the

B port tracks the VCCB level. This allows for bi-directional

voltage translation over a variety of voltage levels:

1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V.

The device remains in 3-state until both VCCs reach

active levels, allowing either VCC to be powered-up first.

Internal power-down control circuits place the device in

3-state if either VCC is removed.

The Transmit / Receive (T/R) input determines the

direction of data flow through the device. The OE input,

when HIGH, disables both the A and B ports by placing

them in a 3-state condition. The FXL2T245 is designed

so control pins T/R and OE are supplied by VCCA.

Ordering Information

Part Number

Operating

Temperature Range

Package

FXL2T245L10X

-40°C to +85°C

10-Lead, MicroPak™, JEDEC MO255,1.6 x 2.1 mm

Packing

Method

Tape and Reel

© 2005 Fairchild Semiconductor Corporation

FXL2T245 • Rev. 1.0.2

www.fairchildsemi.com

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