FXL2T245 Просмотр технического описания (PDF) - ON Semiconductor
Номер в каталоге
Компоненты Описание
производитель
FXL2T245 Datasheet PDF : 13 Pages
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Physical Dimensions
0.05 C
2X
2.10
A
B
(0.11)
1.62
KEEPOUT ZONE, NO TRACES
OR VIAS ALLOWED
0.56
1.12
1.60
PIN1 IDENT IS
2X LONGER THAN
OTHER LINES
TOP VIEW
0.05 C
C SIDE VIEW
0.05 C
2X
0.50±0.05
0.025±0.025
0.50
(0.35) 10X
(0.25) 10X
RECOMMENDED LAND PATTERN
(0.10±0.10)
0.20±0.05
0.30±0.05
2.10±0.05
0.15±0.05
0.30±0.05
DETAIL A
D
0.60±0.05
0.20±0.05
1
10
(0.31)
9
0.50
1.62
(0.20±0.20)
(0.36) 2X
DETAIL A 2X SCALE
(0.09±0.09) 10X
4
0.56
NOTES:
A. PACKAGE CONFORMS TO JEDEC
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
5
0.30±0.05
9X
1.60±0.05
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. PRESENCE OF CENTER PAD IS PACKAGE
6
SUPPLIER DEPENDENT. IF PRESENT IT IS
0.20±0.05
9X
NOT INTENDED TO BE SOLDERED AND HAS A
BLACK OXIDE FINISH.
E. DRAWING FILENAME: MKT-MAC10Arev6.
0.10 C A B
F. DIMENSIONS WITHIN ( ) ARE UNCONTROLLED
0.05 C
ALL FEATURES
BOTTOM VIEW
Figure 6. 10-Lead, MicroPak™, JEDEC MO255,1.6 x 2.1 mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MA/MAC10A.pdf.
For current packing container specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-MAC10A.pdf.
© 2005 Fairchild Semiconductor Corporation
FXL2T245 • Rev. 1.0.2
10
www.fairchildsemi.com
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