DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

NCP512(2003) Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге
Компоненты Описание
производитель
NCP512
(Rev.:2003)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
NCP512 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
NCP512
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.5 mm (min)
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉ
1.9 mm
SC70−5
(SC−88A/SOT−353)
http://onsemi.com
8

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]