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MTSF3N03HD Просмотр технического описания (PDF) - ON Semiconductor

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MTSF3N03HD
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MTSF3N03HD Datasheet PDF : 12 Pages
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MTSF3N03HD
di/dt = 300 A/µs
Standard Cell Density
trr
High Cell Density
trr
ta
tb
t, TIME
Figure 13. Reverse Recovery Time (trr)
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curve (Figure
14) defines the maximum simultaneous drain–to–source
voltage and drain current that a transistor can handle safely
when it is forward biased. Curves are based upon maximum
peak junction temperature and a case temperature (TC) of
25°C. Peak repetitive pulsed power limits are determined by
using the thermal response data in conjunction with the
procedures discussed in AN569, “Transient Thermal
Resistance – General Data and Its Use.”
Switching between the off–state and the on–state may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (VDSS) is exceeded, and that the
transition time (tr, tf) does not exceed 10 µs. In addition the
total power averaged over a complete switching cycle must
not exceed (TJ(MAX) – TC)/(RθJC).
A power MOSFET designated E–FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and must be adjusted for operating
conditions differing from those specified. Although industry
practice is to rate in terms of energy, avalanche energy
capability is not a constant. The energy rating decreases
non–linearly with an increase of peak current in avalanche
and peak junction temperature.
Although many E–FETs can withstand the stress of
drain–to–source avalanche at currents up to rated pulsed
current (IDM), the energy rating is specified at rated
continuous current (ID), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 15). Maximum
energy at currents below rated continuous ID can safely be
assumed to equal the values indicated.
100
250
VGS = 20 V
SINGLE PULSE
TC = 25°C
100 µs
200
10
1 ms
10 ms
150
1
dc
100
VDD = 30 V
VGS = 5 V
IL = 9 A
L = 5 mH
0.1
0.01
0.1
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
1
10
100
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 14. Maximum Rated Forward Biased
Safe Operating Area
50
0
25
50
75
100
125
150
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 15. Maximum Avalanche Energy versus
Starting Junction Temperature
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