HMC409LP4E Просмотр технического описания (PDF) - Analog Devices
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HMC409LP4E Datasheet PDF : 8 Pages
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HMC409LP4E
v04.1217
GaAs InGaP HBT 1 WATT
POWER AMPLIFIER, 3.3 - 3.8 GHz
Absolute Maximum Ratings
Typical Supply, Current vs. Supply
Voltage, Vcc1 = Vcc2 = Vpd
Collector Bias Voltage (Vcc1, Vcc2)
Control Voltage (Vpd)
RF Input Power (RFIN)(Vs = Vpd = +5Vdc)
Junction Temperature
Continuous Pdiss (T = 85 °C)
(derate 57.5 mW/°C above 85 °C)
Thermal Resistance
(junction to ground paddle)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
Outline Drawing
+5.5 Vdc
+5.5 Vdc
+10 dBm
150 °C
3.74 W
Vs (Vdc)
4.75
5.0
5.25
Icq (mA)
516
615
721
17.4 °C/W
-65 to +150 °C
-40 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Class 1A,
24-LPeaasdseLde2a5d0FVrame Chip Scale Package [LFCSP]
4 x 4 mm Body and 0.85 mm Package Height
(CP-24-16)
Dimensions shown in millimeters
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.30
0.25
0.18
19
18
24
1
0.50
BSC
EXPOSED
PAD
DETAIL A
(JEDEC 95)
PIN 1
INDICATOR AREA OPTIONS
(SEE DETAIL A)
2.85
2.70 SQ
2.55
0.90
0.85
0.80
SEATING
PLANE
TOP VIEW
13
6
0.50
0.40
12
7
BOTTOM VIEW
0.20 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.
24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.85 mm Package Height
(CP-24-16)
Dimensions shown in millimeters.
Package Information
Part Number
Package Body Material
Lead Finish
HMC409LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
MSL Rating
MSL3 [1]
Package Marking [2]
H409
XXXX
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
5
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
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