HMC562 Просмотр технического описания (PDF) - Micross Components

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HMC562

GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER

Micross Components 

v04.1108

Outline Drawing

2

HMC562

GaAs PHEMT MMIC WIDEBAND

DRIVER AMPLIFIER, 2 - 35 GHz

Die Packaging Information [1]

Standard

Alternate

GP-2

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS IN INCHES [MILLIMETERS]

2. DIE THICKNESS IS 0.004 (0.100)

3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE

4. BOND PAD METALIZATION: GOLD

5. BACKSIDE METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS

8. OVERALL DIE SIZE IS ±.002

2 - 38

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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