HCPL-530K Просмотр технического описания (PDF) - Broadcom Corporation

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HCPL-530K

Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers

Broadcom Corporation 

HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852

Data Sheet

Schematic Diagram

Schematic Diagram

1

2

3

4

SHIELD

8

20 k:

7

6

5

Truth Table

LED

VO

ON

L

OFF

H

NOTE The connection of a 0.1-μF bypass capacitor

between pins 5 and 8 is recommended.

Outline Drawing

8-Pin DIP, Through Hole, 1 Channel

10.03 (0.395)

10.29 (0.405)

1.02 (0.040)

1.52 (0.060)

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

3.81 (0.150)

MIN.

8.13 (0.320)

MAX.

7.16 (0.282)

7.57 (0.298)

0.20 (0.008)

0.33 (0.013)

Selection Guide–Lead Configuration

Options

Part Numbers and Options

Commercial

MIL-PRF-38534, Class H

MIL-PRF-38534, Class K

Standard Lead Finisha

Solder Dippedb

Butt Cut/Gold Platea

Gull Wing/Solderedb

Class H SMD Part #

Prescript for all below

Gold Platea

Solder Dippedb

Butt Cut/Gold Platea

Butt Cut/Solderedb

Gull Wing/Solderedb

Class K SMD Part #

Prescript for all below

Gold Platea

Solder Dippedb

Butt Cut/Gold Platea

Butt Cut/Solderedb

Gull Wing/Solderedb

HCPL-5300

HCPL-5301

HCPL-530K

Gold Plate

Option #200

Option #100

Option #300

5962-

9685201HPC

9685201HPA

9685201HYC

9685201HYA

9685201HXA

5962-

9685201KPC

9685201KPA

9685201KYC

9685201KYA

9685201KXA

a. Gold Plate lead finish: Maximum gold thickness of leads is <100

micro inches. Typical is 60 to 90 micro inches.

b. Solder lead finish: Sn63/Pb37.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

7.36 (0.290)

7.87 (0.310)

Broadcom

-2-

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